Introducing the EB30 Integrated Coating Module with eBeam Curing – a game-changer in the world of flexible packaging. Designed specifically for HP Indigo, this FDA-compliant system is the pinnacle of food safety, ensuring your products remain in pristine condition. With full control over the curing process, the EB30 guarantees the highest quality results and boasts the best Total Cost of Ownership (TCO) on the market.
The EB30 offers unparalleled benefits, such as outstanding ink protection, glossy, matte, and soft-touch finishes, and increased heat resistance for secure pouch sealing. Say goodbye to harmful photoinitiators, thanks to its innovative curing technology, and hello to a room-temperature process that's gentle on heat-sensitive substrates. Plus, its high process efficiency ensures instant curing without the need for post-processing storage. Experience the future of packaging with EB30 – where safety, quality, and efficiency converge seamlessly.
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Technical Specification | |
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Web width | 762 mm |
Substrate thickness | 50 - 200 µm |
Speed max. | 72 m/min |
Max rewind diameter | 500 mm |
Core diameter | 76,2 mm |
Varnishing roller (Flexo Station) | 228 - 406 mm |
Spot varnish option with registration and slow run (Flexo Station) | |
Length approx. (Flexo Station) | 8,6 m |
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